THE WORLD'S LARGEST SPIN COATER
Coater for large substrates
GPTG project, advanced package and many applications like AI and other microchips.
The world's largest spincoater with C3+ technology is now available for demonstration at ON Nano in our demo laboratory.
Coating setups for thicknesses from 5 nm up to 1 mm, with many features for perfect coating, are available. A hotplate for large sizes and other processes relevant equipment is also available in the laboratory.
The system is ready to handle all size and processes for the GPS Glass Panel Substrates.
It features functions from the fully automated equipment but manually loaded.
SEMIAUTOMATED SYSTEM
In our semi-automated production environment, all equipment is manually loaded while the coating and development processes remain fully automated. This hybrid approach ensures operational flexibility without compromising precision or throughput.
Our range includes spin coaters, spray coaters,
developers, hotplates, and HMDS systems —
all engineered for reliability and performance. All equipment is available either for bench-top mounting or as a stand-alone configuration —tailored to meet your space and workflow needs.
COATING, DEVELOPING, HEATING AND CLEANING FOR WAFERS AND SUBSTRATES OF ANY SIZE
Redefining Substrate Manufacturing: C3+ Patent Reveal Coming Soon!
Based on the latest and exceptional test and application results from our customers and partners, we have identified that the combination of our Cover Chuck Coating with our Thermal Processing, the hydraulic dispense pump and the new developed large glass plate developer improves the performance and also enhances the entire process chain — coating, developing, heating, cleaning, and etching — in a sustainable and measurable way. The C3+ process patent update consolidates all of these individual processes into a new single patent.
These performance improvements have been clearly demonstrated on wafers, organic panels, and ultra‑large glass panels (1.1 m × 1.1 m).
With the upcoming C3+ Process, we provide our customers with a significant technological advantage: increased precision (more uniform layer distribution, improved edge control, higher process stability), higher throughput (more stable takt times, shorter process cycles), improved yields (lower defect rates, higher reproducibility), and significantly reduced process costs (less consumable usage, lower energy demand, optimized equipment availability) — across the entire value chain.
1100 mm
540 mm
nanoCOAT 1800
nanoLAB 750
CLEANING & ETCHING
Single Substrate cleaning and etching system
Fully automated system for any industry
Developer, Cleaner, Etcher up to 300mm and 9x9“ Mask.
Advanced processes for Cleaning or Etching with our new with Gas Phase process, reduces chemicals usage more than 90%.
High-Quality cleaning and Etching processes in a multi chamber system
OUR FULLY AUTOMATED COATER & DEVELOPER
The new ON Nano Matrix Coater, Developer and Hot Module provide optimal process performance with gentle substrate handling and and new technology advancements for glass and transparent wafers.
All process modules are arranged in horizontal rows and vertical columns.
This setup allows for concise and fast substrate processing and transfer.
The ON Matrix system is used in various semiconductor fields. High volume production, front end and back end processing, sensor production, scientific R&D, OLED and micro OLED manufacturing and defense and security manufacturing.
The ON Matrix unit with fully loaded modules has the smallest footprint and is the most compact unit on the market.
300 MM COATER DEVELOPER FOR HIGH THROUGHPUT WITH MANY FEATURES
Up to 10 coater or developer spin module
Up to 30 hots-tacks for HMDS, hotplate,
Low O2 plate, Coolplate,
In situ coating thickness measurement
Cleanroom environment with temperature and humidity-controlled atmosphere
SECS/GEM compatible